Do you want to
in your packaging plant?
Thereby we help you. By the integral analysis of
we find the optimal solution for your application.
Your advantage is our close co-operation to the Fraunhofer - research institutes in Dresden, Freising and Dortmund. For this reason we have acces to state of the art research results and facts to provide economical solutions.
Testing machine for printed circuit cards. It was a joint project with test-line-electronics for our customer OTIS, Berlin.
For the Fraunhofer - application center for processing machinery and packaging technology in Dresden (AVV) we developed and implemented a test rig for web-shaped packaging materials. Thus the processing behavior of flexible packaging materials can be investigated (http://www.ivv.fraunhofer.de/).